Package Structure and Communications Device

A package structure, comprising:

• a substrate;
• a die;
• a first shielding structure;
• and
• a bonding layer bonding the die to the substrate, wherein charged particles are disposed in the bonding layer, a first electrode is disposed on a surface of the die that faces away from the bonding layer, a potential of the first electrode is opposite to a potential of the charged particle, a potential of the substrate is zero, the first shielding structure is located on an outer surface of the die and is disposed between the bonding layer and the first electrode.

A communications device, comprising:

• a radio frequency passive device;
• a radio frequency small signal device;
• and
• a package structure connected between the radio frequency small signal device and the radio frequency passive device, wherein the package structure comprises:
• a substrate;
• a die;
• a first shielding structure;
• and
• a bonding layer bonding the die to the substrate, wherein charged particles are disposed in the bonding layer, a first electrode is disposed on a surface of the die that faces away from the bonding layer, a potential of the first electrode is opposite to a potential of the charged particle, a potential of the substrate is zero, the first shielding structure is located on an outer surface of the die and is disposed between the bonding layer and the first electrode.