Multi-molding method for fan-out stacked semiconductor package

A multi-molding method for fan-out stacked semiconductor package, comprising:

• (a) providing a carrier for a fan-out semiconductor level package;
• (b) forming multiple first packages on the carrier;
• (c) placing the multiple first packages in a first molding chamber to form a first molding compound encapsulating the first packages;
• (d) forming a first redistribution layer on an exposed surface of the first molding compound;
• (e) forming multiple second packages on the first redistribution layer;
• (f) placing the first molding compound, the first redistribution layer and the second packages in a second molding chamber to form a second molding compound encapsulating the first molding compound and the first redistribution layer;
• wherein the second molding chamber is larger than the first molding chamber;
• (g) removing the carrier;
• and
• (h) executing a singulation process to produce multiple fan-out stacked semiconductor packages.