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US 2021/0280518 A1Published application
Emib architecture with dedicated metal layers for improving power delivery
AssigneeIntel Corporation
InventorsJianyong XIE, Sujit SHARAN, Huang-Ta CHEN
Life of this patent
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Abstract
Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.
Claims25
A bridge, comprising:
- a substrate;
- a routing stack over the substrate, wherein the routing stack comprises:
- first routing layers, wherein individual ones of the first routing layers have a first thickness;
- and
- a second routing layer, wherein the second routing layer has a second thickness that is greater than the first thickness.
2 more elements
An electronic package, comprising:
- a package substrate;
- a bridge embedded in the package substrate, wherein the bridge comprises:
- a substrate;
- a routing stack over the substrate, wherein the routing stack comprises a first routing layer with a first thickness and a second routing layer with a second thickness, wherein the second thickness is greater than the first thickness;
- a first die electrically coupled to the bridge;
- and
- a second die electrically coupled to the bridge, wherein the first die is electrically coupled to the second die by the first routing layer.
4 more elements
An electronic system, comprising:
- a board;
- a package substrate attached to the board;
- a bridge embedded in the package substrate, wherein the bridge comprises at least five routing layers, and wherein at least one of the routing layers has a first thickness that is greater than a second thickness of other routing layers;
- a first die coupled to the bridge;
- and
- a second die coupled to the bridge, wherein the first die is electrically coupled to the second die by one or more of the routing layers.
3 more elements
Dependencies are inferred from the claim text.