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US 2021/0280512 A1Published application
Package Panel Processing With Integrated Ceramic Isolation
AssigneeTexas Instruments Incorporated
InventorsWoochan Kim, Benjamin Allen Samples, Vivek Kishorechand Arora
Life of this patent
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Abstract
A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.
Claims21
1-16. (canceled)
A method for fabricating a packaged electronic device, the method comprising:
- attaching an organic panel frame to an adhesive carrier structure;
- attaching a plurality of semiconductor dies to the adhesive carrier structure in openings of the organic panel frame;
- forming a lamination structure in gaps between the organic panel frame and the semiconductor dies;
- removing the adhesive carrier structure;
- forming a redistribution layer (RDL) structure with a conductive structure electrically connected to contact structures of the semiconductor dies;
- attaching a ceramic substrate to the semiconductor dies;
- and
- separating a packaged electronic device from the panel.
5 more elements
A method for fabricating a packaged electronic device, the method comprising:
- placing a semiconductor die in an opening in an organic panel frame;
- forming a lamination structure in gaps between the organic panel frame and the semiconductor die;
- forming a redistribution layer (RDL) structure with a conductive structure electrically connected to contact structures of the semiconductor die;
- and
- attaching a ceramic substrate to the semiconductor die.
2 more elements
Dependencies are inferred from the claim text.