Package comprising dummy interconnects

An apparatus comprising:

• a substrate comprising a first surface and a second surface, wherein the substrate further comprises a plurality of interconnects;
• a passive device coupled to the first surface of the substrate;
• first means for encapsulation located over the first surface of the substrate, wherein the first means for encapsulation encapsulates the passive device;
• an integrated device coupled to the second surface of the substrate;
• second means for encapsulation located over the second surface of the substrate, wherein the second means for encapsulation encapsulates the integrated device;
• a plurality of through encapsulation layer interconnects coupled to the substrate;
• a plurality of encapsulation layer interconnects coupled to the plurality of through encapsulation layer interconnects;
• and
• at least one dummy interconnect located in the second means for encapsulation, wherein the at least one dummy interconnect is located vertically over a back side of the integrated device.

A method for fabricating a package, comprising:

• providing a substrate comprising a first surface and a second surface, wherein the substrate further comprises a plurality of interconnects;
• coupling a passive device to the first surface of the substrate;
• forming a first encapsulation layer over the first surface of the substrate, wherein the first encapsulation layer encapsulates the passive device;
• coupling an integrated device to the second surface of the substrate;
• providing a plurality of through encapsulation layer interconnects to the substrate;
• forming a second encapsulation layer over the second surface of the substrate, wherein the second encapsulation layer encapsulates the integrated device;
• providing a plurality of encapsulation layer interconnects to the plurality of through encapsulation layer interconnects;
• and
• providing at least one dummy interconnect in the second encapsulation layer, wherein the at least one dummy interconnect is located vertically over a back side of the integrated device.