Wiring structure and method for manufacturing the same

A wiring structure, comprising:

• a first stacked structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;
• a second stacked structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer, wherein a width of the second stacked structure is less than a width of the first stacked structure;
• a dent structure attached to the first stacked structure, and defining a central cavity;
• and
• an adhesion layer disposed in the central cavity, and the second conductive structure is attached to the adhesion layer in the central cavity of the dent structure.

A method for manufacturing a wiring structure, comprising:

• (a) providing a first conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;
• (b) forming a dent structure on the first conductive structure to define a central cavity;
• (c) disposing an adhesion layer in the central cavity;
• (d) providing a second conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;
• and
• (e) attaching the second conductive structure to the first conductive structure through the adhesion layer.