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US 2021/0280501 A1Published application
Pressurized semiconductor package and method of manufacturing the same
AssigneeJMJ Korea Co., Ltd.
InventorsYun Hwa CHOI, Jeonghun CHO
Life of this patent
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Abstract
Provided is a pressurized semiconductor package including a lead frame including a pad board and a first terminal, a semiconductor chip, pressurizing members stacked to pressurize the semiconductor chip, and a package housing. The semiconductor chip is physically pressurized by the pressurizing members and is electrically connected to improve durability of the semiconductor package and to simplify a manufacturing process.
Claims20
A pressurized semiconductor package comprising:
- a lead frame comprising at least one pad board and at least one first terminal formed on the pad board;
- at least one semiconductor chip placed on the lead frame;
- at least one pressurizing member stacked on the semiconductor chip to pressurize the semiconductor chip so as to electrically connect the first terminals to the semiconductor chips;
- and
- a package housing formed on the pad boards to protect the semiconductor chips.
2 more elements
A method of manufacturing a pressurized semiconductor package, the method comprising:
- preparing a lead frame comprising at least one pad board and at least one first terminal formed on the pad board;
- placing at least one semiconductor chip on the lead frame;
- stacking at least one pressurizing member on the semiconductor chip to pressurize the semiconductor chip so as to electrically connect the first terminals to the semiconductor chips;
- and
- forming a package housing formed on the pad boards to protect the semiconductor chips.
2 more elements
Dependencies are inferred from the claim text.