Semiconductor device

A packaged semiconductor device, comprising:

• a first frame having a first surface;
• a second frame spaced from the first frame in a first direction;
• a semiconductor chip mounted on the first surface, the semiconductor chip having a first electrode on a first side facing the first surface and a second electrode on a second side facing away from the first frame;
• and
• a connector plate having a lower surface that is joined to the second electrode by solder and an upper surface facing away from the second electrode, the connector plate having at least one edge including a change in height less than a full thickness of the connector plate, the change occurring at a position above the second electrode such that an outer edge of the lower surface on the at least one edge of the connector plate is inside an outer edge of the second electrode, an outer edge of the upper surface on the at least one edge of the connector play being beyond the outer edge of the second electrode, the connector plate electrically connecting the second electrode to the second frame.

A semiconductor device, comprising:

• a first frame;
• a second frame spaced from the first frame;
• a semiconductor chip having a first electrode on a first surface facing the first frame and a second electrode on a second surface facing away from the first frame, the first electrode being electrically connected to the first frame;
• and
• a connector plate joined to the second electrode with a solder and electrically connecting the second electrode to the second frame, wherein
• the connector plate has an upper surface facing away from the semiconductor chip, a first lower surface facing the second electrode, a first end surface intersecting the first lower surface, a second lower surface facing towards the semiconductor chip and intersecting the first end surface, and a second end surface intersecting second lower surface and the upper surface,
• an outer edge of the second electrode is at a position along a first direction that is parallel to the second surface that is between a position along the first direction of the first end surface and a position along the first direction of the second end surface,
• a distance between the second lower surface and the second electrode is greater than a distance between the first lower surface and the second electrode, and
• the solder has a first portion between the first lower surface and the second electrode and a second portion between the second lower surface and the second electrode, the second portion contacting the second end surface and being thicker than the first portion.