Cooling apparatus
AssigneeLG Electronics Inc.
InventorsMyeon Gyu KANG, Yong Sik KIM, Namjoon CHO
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AssigneeLG Electronics Inc.
InventorsMyeon Gyu KANG, Yong Sik KIM, Namjoon CHO
Estimating the term…
The present invention is a cooling apparatus, and a cooling apparatus according to one embodiment of the present invention comprises: cooling jackets, each comprising a main body and a plurality of cooling fins, the main body comprising an upper plate and a lower plate that is joined to the upper plate, and providing a coolant flow channel via the internal space between the upper and lower plates, and the plurality of cooling fins being are arranged inside the main bodies, along the coolant flow channels, so as to be spaced apart from one-another by a set distance, and being connected between the upper and lower plates; and a plurality of double-sided chip modules which are disposed between at least two cooling jackets, with the upper and lower surfaces of the double-sided chip modules contacting the cooling jackets, wherein the plurality of double-sided chip modules are disposed spaced apart from one-another in correspondence with the locations of the cooling fins and positioned so as to be able to face one-another, and thus the upper and lower surfaces can be simultaneously cooled.
A cooling apparatus, comprising:
Dependencies are inferred from the claim text.