Methods of forming flexure based cooling solutions for package structures

A microelectronic package structure comprising:

• a first side of a die disposed on a substrate;
• a cooling structure disposed on a second side of the die, wherein the cooling structure comprises:
• a first section and a second section;
• a first opening adjacent a first edge of the second section;
• and
• a second opening adjacent a second edge of the second section, wherein the second section is disposed between the first opening and the second opening, and wherein the first section is disposed on an outer edge the first and second openings, wherein at least one flexure beam structure extends between the first and the second sections.

A microelectronic package structure comprising:

• a first side of a die on a first side of a substrate;
• a cooling structure on a second side of the die, wherein the cooling structure comprises:
• a first portion attached to the substrate;
• and
• a second portion disposed on a second side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure beam structure connects the first and second portions.

A method of forming a microelectronic package structure, comprising:

• placing a cooling structure on a die disposed on a substrate, wherein the cooling structure comprises:
• a first portion disposed over a portion of the substrate adjacent the die;
• a second portion disposed on a back side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure structure connects the first and second portions;
• and
• attaching the cooling structure to the substrate, wherein the at least one flexure beam structure decouples a load strain from the first portion and the second portion.