US 2021/0280485 A1Published application

Device and forming method of device

AssigneeJapan Aviation Electronics Industry, Limited

InventorShinji UEDA

Life of this patent

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Abstract

A device comprises: a first film having a first inner portion, a first seal portion and a first contact portion; a second film having a second inner portion, a second seal portion and a second contact portion; a first circuit member having a first contact point; and a second circuit member having a second contact point. The first seal portion and the second seal portion are bonded together. The first contact portion and the second contact portion are in contact with each other in a contact region which surrounds the first inner portion and the second inner portion throughout their entire circumference. The first circuit member and the second circuit member are shut in a closed space which is enclosed by the first inner portion and the second inner portion. The first contact point and the second contact point are in contact with each other.

Claims15

Dependent claims

A device comprising a first film, a second film, a first circuit member and a second circuit member, wherein:

the first film has a first inner portion and a first outer portion;
the first inner portion is located inward of the first outer portion;
the second film has a second inner portion and a second outer portion;
the second inner portion is located inward of the second outer portion;
the first outer portion has a first seal portion and a first contact portion;
the second outer portion has a second seal portion and a second contact portion;
the first seal portion and the second seal portion are bonded together to form a seal trace;
the first contact portion and the second contact portion are in contact with each other in a contact region;
the contact region surrounds the first inner portion and the second inner portion throughout their entire circumference;
the device is formed with a closed space which is enclosed by the first inner portion and the second inner portion;
the first circuit member and the second circuit member are shut in the closed space;
the first circuit member comprises a first contact point;
the second circuit member comprises a second contact point;
and
the first contact point and the second contact point are in contact with each other.

12 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/152,877Filed 20 Jan 2021
Priority: JP 2020-0471778 Mar 2020
Published: 9 Sep 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

B32B 3/04
Characterised by features of form at particular places, e.g. in edge regions: characterised by at least one layer folded at the edge, e.g. over…
H10W 74/127
The semiconductor body being completely enclosed: characterised by arrangements for sealing or adhesion
B32B 3/08
Characterised by features of form at particular places, e.g. in edge regions: characterised by added members at particular parts
B32B 7/05
Interconnection of layers: the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection

Family

US 11,469,150 B2Related patent
US 2021/0280485 A1This patent

From the US filing history. Foreign family members aren’t listed.

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