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US 2021/0280481 A1Published application
Protection structures in semiconductor chips and methods for forming the same
AssigneeYangtze Memory Technologies Co., Ltd.
InventorJialan He
Life of this patent
Estimating the term…
Abstract
Embodiments of semiconductor chips and fabrication methods thereof are disclosed. In one example, a semiconductor chip includes a main chip region and a protection structure surrounding the main chip region in a plan view. The protection structure includes a dielectric layer and a conductive portion in the dielectric layer. The conductive portion includes a conductive layer and a core having a material different from that of the conductive layer.
Claims20
A semiconductor chip, comprising:
- a main chip region;
- and
- a protection structure surrounding the main chip region in a plan view and comprising a dielectric layer and a conductive portion in the dielectric layer,
- wherein the conductive portion comprises a conductive layer and a core having a material different from that of the conductive layer.
1 more element
A semiconductor chip, comprising:
- a main chip region;
- and
- a protection structure surrounding the main chip region in a plan view and comprising a single conductive portion,
- wherein the single conductive portion comprises a conductive layer and a core surrounded by the conductive layer in a side view.
1 more element
A method for forming a protection structure of a semiconductor chip, comprising:
- forming a trench surrounding a main chip region of the semiconductor chip in a plan view;
- and
- forming a conductive portion to fully fill the trench, wherein the conductive portion comprises a conductive layer and a core having a material different from that of the conductive layer.
Dependencies are inferred from the claim text.