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US 2021/0280480 A1Published application
Semiconductor device
AssigneeKioxia Corporation
InventorsYuki SUGO, Ayana AMANO, Keiichiro HATTORI, Takeshi WATANABE
Life of this patent
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Abstract
A semiconductor device of an embodiment includes: a wiring board; a semiconductor chip mounted on the wiring board; and a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board. The resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
Claims20
A semiconductor device comprising:
- a wiring board;
- a semiconductor chip mounted on the wiring board;
- and
- a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board, wherein
- the resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
2 more elements
A semiconductor device comprising:
- a wiring board;
- a first semiconductor chip mounted on the wiring board;
- a resin-containing layer provided on the wiring board so that the first semiconductor chip is embedded therein;
- and
- a plurality of second semiconductor chips stacked and mounted above the first semiconductor chip, wherein
- the resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
3 more elements
A semiconductor device comprising:
- a wiring board;
- a plurality of semiconductor chips mounted on the wiring board;
- adhesion layers bonded between the wiring board and a first chip on a lower side in the plurality of semiconductor chips and between the first chip and a second chip on a upper side in the plurality of semiconductor chips, wherein
- an adhesive layer bonding the wiring board and the first chip contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
1 more element
Dependencies are inferred from the claim text.