Radio Frequency Package Implementing a Window Frame with Edge Plating and Processes of Implementing the Same

A process of implementing a radio frequency (RF) package, comprising:

• configuring a support having a semiconductor die attach region;
• configuring a frame comprising an electrically insulative member having a lower side attached to the support and an upper side opposite the support;
• configuring the frame to have an opening at least partially registered with said semiconductor die attach region;
• configuring the frame with an upper metallization at the upper side of the electrically insulative member and a lower metallization at the lower side of the electrically insulative member;
• and
• configuring the frame with an electrically conductive edge connection connecting the upper metallization to the lower metallization.