Semiconductor wafer and semiconductor chip
AssigneeKioxia Corporation
InventorMika FUJII
Life of this patent
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Abstract
According to one embodiment, a semiconductor wafer is formed with a plurality of first regions each provided with a circuit element and a second region between the first regions. The semiconductor wafer includes a first structure in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of a substrate. The first structure is between edges of the first regions and a third region that is cut in the second region when the first regions are separated.
Claims20
A semiconductor wafer formed with a plurality of first regions each provided with a circuit element and a second region between the first regions, the semiconductor wafer comprising:
- a first structure in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of a substrate, the first structure being between edges of the first regions and a third region that is cut in the second region when the first regions are separated.
A semiconductor chip comprising:
- a semiconductor substrate including a first region provided with a circuit element and a second region formed around the first region;
- a device layer formed on the semiconductor substrate;
- and
- a first structure formed in the device layer in the second region and in which a first embedding material is embedded in a first recess extending in a first direction perpendicular to a surface of the semiconductor substrate.
Dependencies are inferred from the claim text.