Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorMitsuaki SATO
Life of this patent
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Abstract
A substrate processing apparatus that includes a chamber, a substrate support disposed in the chamber, and a connection is provided. The chamber is provided with a bottom including a first flow path, and the substrate support includes a second flow path. The connection connects the first flow path to the second flow path, and the connection includes a sleeve through which the first flow path is in fluid communication with the second flow path, and a core including a first rod segment and a first elastic foam segment. The core is disposed in the sleeve, and a gap is defined between an inner surface of the sleeve and a side surface of the first rod segment.
Claims10
A substrate processing apparatus comprising:
- a chamber including a bottom including a first flow path;
- a substrate support disposed in the chamber, the substrate support including a second flow path;
- and
- a connection disposed between the bottom of the chamber and the substrate support, the connection being connected to the first flow path and the second flow path, the connection including
- a sleeve through which the first flow path is in fluid communication with the second flow path, and
- a core disposed in the sleeve, the core including a first rod segment and a first elastic foam segment, a gap being defined between an inner surface of the sleeve and a side surface of the first rod segment.
Dependencies are inferred from the claim text.