Stage and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorTakehiro UEDA
Life of this patent
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Abstract
A stage to be disposed in a chamber of a plasma processing apparatus is provided. The stage includes a chuck with a mounting portion for a substrate and a first hole through the mounting portion. The stage includes a base disposed beneath the chuck, the base including a second hole through the base, and the second hole communicating with the first hole. The base includes a first cylindrical liner disposed in the second hole, the first cylindrical liner having a relative permittivity of 5 or less.
Claims13
A stage to be disposed in a chamber of a plasma processing apparatus, the stage comprising:
- a chuck including a first mounting portion for a substrate and a first hole through the first mounting portion;
- a base disposed beneath the chuck, the base including a second hole through the base, and the second hole communicating with the first hole;
- and
- a first cylindrical liner disposed in the second hole, the first cylindrical liner having a relative permittivity of 5 or less.
A plasma processing apparatus comprising:
- a chamber;
- a stage disposed in the chamber;
- and
- a radio frequency source,
- wherein the stage includes:
- a chuck including a first mounting portion for a substrate and a first hole through the first mounting portion;
- a base beneath the chuck, the base including a second hole through the base, the second hole communicating with the first hole;
- and
- a first cylindrical liner disposed in the second hole, the first cylindrical liner having a relative permittivity of 5 or less.
Dependencies are inferred from the claim text.