Mounting method and mounting device

A mounting method for mounting by a mounting head a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table, the mounting method comprising:

• affixing the second face of the semiconductor chip to a first adhesive member;
• removing the carrier substrate from the semiconductor chip;
• affixing a second adhesive member to the first face of the semiconductor chip;
• reducing an adhesive strength of the first adhesive member;
• separating the semiconductor chip that has been affixed to the second adhesive member from the first adhesive member;
• affixing the second face of the semiconductor chip to a third adhesive member;
• reducing an adhesive strength of the second adhesive member;
• and
• mounting the semiconductor chip on the circuit board by holding the first face of the semiconductor chip with the mounting head to separate the semiconductor chip from the third adhesive member, and joining the second face of the semiconductor chip to the circuit board,
• an adhesive strength of the third adhesive member being less than the adhesive strength of the first adhesive member.

A mounting device configured to mount a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table, the mounting device comprising:

• an adhesive sheet holder that-holds configured to hold an adhesive sheet to which the second face of the semiconductor chip is configured to be affixed;
• a carrier substrate remover configured to remove the carrier substrate from the semiconductor chip that has been affixed to the adhesive sheet;
• an adhesive strength reducer configured to reduce an adhesive strength of the adhesive sheet;
• a head configured to hold the semiconductor chip from a first face side of the semiconductor chip;
• and
• a controller configured to control the head to hold the semiconductor chip to separate the semiconductor chip from the adhesive sheet, and to join a second face side of the semiconductor chip to the circuit board.

A mounting device configured to mount by a mounting head a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table, the mounting device comprising:

• a first adhesive member holder having a first adhesive member heating mechanism and configured to hold a first adhesive member;
• a carrier substrate remover configured to remove the carrier substrate from the semiconductor chip that has been affixed to the first adhesive member;
• a first transfer head that-has having a first transfer head heating mechanism and configured to affix a second adhesive member to the first face of the semiconductor chip;
• a second transfer head having a second transfer head heating mechanism and that configured to affix the semiconductor chip to a third adhesive member;
• a third adhesive member holder having a third adhesive member heating mechanism and configured to hold the third adhesive member;
• a first adhesive strength reducer configured to reduce an adhesive strength of the first adhesive member;
• and
• a second adhesive strength reducer configured to reduce an adhesive strength of the second adhesive member,
• an adhesive strength of the third adhesive member being less than the adhesive strength of the first adhesive member.