Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
AssigneeKioxia Corporation
InventorsKatsuhiro SATO, Hiroshi FUJITA, Yoshinori KITAMURA, Satoshi NAKAOKA, Tomohiko SUGITA
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AssigneeKioxia Corporation
InventorsKatsuhiro SATO, Hiroshi FUJITA, Yoshinori KITAMURA, Satoshi NAKAOKA, Tomohiko SUGITA
Estimating the term…
In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a substrate, and a pipe configured to supply the container with liquid to treat the substrate. The apparatus further includes an ejector including a first passage where the liquid introduced from the pipe and the liquid introduced from the container are joined and pass through, and a first opening configured to eject the liquid that has passed through the first passage. Furthermore, the first passage has an area where a sectional area of the first passage becomes large as advancing downstream in the liquid.
A semiconductor manufacturing apparatus comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.