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US 2021/0280436 A1Published application
Method of applying conductive adhesive and manufacturing device using the same
AssigneeEpistar Corporation
InventorMin-Hsun HSIEH
Life of this patent
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Abstract
An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.
Claims10
A manufacturing system, comprising:
- a carrier plate configured to accommodate an adhesive material;
- and
- a needle array device arranged on the carrier plate, and comprising a plate and a plurality of needles associated with the plate;
- wherein the plurality of needles is configured to approach the carrier plate for capturing portions of the adhesive material from the carrier plate, and
- wherein the adhesive material comprises a plurality of conductive particles and an insulating binder wherein the plurality of conductive particles is dispersed.
2 more elements
Dependencies are inferred from the claim text.