Semiconductor memory structure and method for forming the same
AssigneeWinbond Electronics Corp.
InventorsShuen-Hsiang KE, Shih-Chieh LIN
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AssigneeWinbond Electronics Corp.
InventorsShuen-Hsiang KE, Shih-Chieh LIN
Estimating the term…
A method for forming a semiconductor memory structure includes forming a hard mask layer over a semiconductor substrate, etching the hard mask layer to form first mask patterns and second mask patterns, transferring the first and second mask patterns to the substrate to form semiconductor blocks, and thinning down the second mask element. After thinning down the second mask element, the thickness of the second mask elements is less than the thickness of the first mask elements. The method also includes forming a first capping layer to laterally extend over the first mask patterns and the second mask patterns, and etching the first capping layer and the second mask pattern to form contact openings.
A method for forming a semiconductor memory structure, comprising:
A semiconductor memory structure, comprising:
Dependencies are inferred from the claim text.