Substrate processing method
AssigneeTokyo Electron Limited
InventorsKeiichi TANAKA, Tatsuo MATSUDO
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Abstract
A substrate processing apparatus of the present disclosure includes a processing container capable of being vacuum-exhausted, a lower electrode, and an upper electrode. A target substrate can be placed on the lower electrode. The upper electrode is disposed in the processing container so as to face the lower electrode. A substrate processing method of the present disclosure includes performing a first process on the target substrate using an AC voltage without using a DC pulse voltage, and performing a second process on the target substrate using the DC pulse voltage.
Claims6
A substrate processing method in a substrate processing apparatus including a processing container capable of being vacuum-exhausted, a lower electrode on which a target substrate can be placed in the processing container, and an upper electrode disposed in the processing container so as to face the lower electrode, the method comprising:
- performing a first process on the target substrate using an AC voltage without using a DC pulse voltage;
- and
- performing a second process on the target substrate using the DC pulse voltage.
Dependencies are inferred from the claim text.