Multi-layer ceramic electronic component, method of producing a multi-layer ceramic electronic component, and circuit board

A method of producing a multi-layer ceramic electronic component, comprising:

• producing a ceramic body including
• a first end surface and a second end surface facing in a direction of a first axis, and
• internal electrodes laminated in a direction of a second axis orthogonal to the first axis and drawn from the first end surface or the second end surface;
• and
• forming a first external electrode disposed to cover the first end surface, and a second external electrode disposed to cover the second end surface, wherein
• each of the first external electrode and the second external electrode has an electrode end surface facing in the direction of the first axis,
• the electrode end surface includes
• a pair of first peripheral regions located at peripheral edges in the direction of the second axis, and
• a first concave region located between the pair of first peripheral regions and recessed from the pair of first peripheral regions, and
• in a cross-section obtained by bisecting the multi-layer ceramic electronic component in a direction of a third axis orthogonal to the first axis and the second axis, b/a is 0.004 or more and 0.025 or less, where a is a length of an imaginary line segment connecting boundaries between each of the pair of first peripheral regions and the first concave region, and b is a length of a longest perpendicular line in the direction of the first axis among perpendicular lines extending from the line segment to the first concave region.

A circuit board, comprising:

• a mounting board;
• a multi-layer ceramic electronic component including
• a ceramic body including
• a first end surface and a second end surface facing in a direction of a first axis,
• a first main surface and a second main surface facing in a direction of a second axis orthogonal to the first axis, and
• internal electrodes laminated in the direction of the second axis and drawn from the first end surface or the second end surface,
• a first external electrode disposed to cover the first end surface, and
• a second external electrode disposed to cover the second end surface,
• the multi-layer ceramic electronic component being disposed such that the first main surface or the second main surface faces the mounting board;
• a first solder that connects the first external electrode and the mounting board to each other;
• and
• a second solder that connects the second external electrode and the mounting board to each other, wherein
• each of the first external electrode and the second external electrode has an electrode end surface facing in the direction of the first axis,
• the electrode end surface includes
• a pair of first peripheral regions located at peripheral edges in the direction of the second axis, and
• a first concave region located between the pair of first peripheral regions and recessed from the pair of first peripheral regions, and
• in a cross-section obtained by bisecting the multi-layer ceramic electronic component in a direction of a third axis orthogonal to the first axis and the second axis, b/a is 0.004 or more and 0.025 or less, where a is a length of an imaginary line segment connecting boundaries between each of the pair of first peripheral regions and the first concave region, and b is a length of a longest perpendicular line in the direction of the first axis among perpendicular lines extending from the line segment to the first concave region.