Thermal leveling

An apparatus, comprising:

• a plurality of memory devices;
• and
• a processing resource coupled to the plurality of memory devices, wherein the processing resource is configured to:
• allocate, based on determined thermal characteristics of the plurality of memory devices, workloads to the plurality of memory devices;
• monitor the workloads running on the plurality of memory devices to determine whether a change in the thermal characteristics measured by a first memory device among the plurality of memory devices corresponding to execution of the workloads has occurred;
• determine that a workload to be subsequently executed by a second memory device among the plurality of memory devices exhibits similar thermal characteristics as a workload running on the first memory device;
• and
• perform a thermal leveling operation for the second memory device based on the determination that the workload to be subsequently executed by the second memory device exhibits similar thermal characteristics as the workload running on the first memory device prior to execution of the subsequently executed workload.

A method, comprising:

• assigning respective values indicative of a thermal impact arising from execution of workloads running on a memory device based, at least in part, on a change in thermal characteristics measured by the memory device during execution of the workloads;
• determining that a workload to be subsequently executed by the memory device is the same in scope to a particular workload running on the memory device;
• and
• performing a thermal leveling operation involving the memory device prior to execution of the workload to be subsequently executed based, at least in part on determining that the workload to be subsequently executed by the memory device is the same in scope to the particular workload running on the memory device.