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US 2021/0278887 A1Published application
Thermal control for electronic devices
AssigneeSamsung Electronics Co., Ltd.
InventorsPyeongwoo Lee, Young deok Kim, Sumanth Jannyavula Venkata
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Abstract
A method for temperature control. In some embodiments, the method includes sensing a first temperature of an electronic device, determining that the first temperature exceeds a first threshold, and increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device. The increasing of the power may include increasing the power in response to determining that the first temperature exceeds the first threshold.
Claims20
A method for temperature control, the method comprising:
- sensing a first temperature of an electronic device;
- determining that the first temperature exceeds a first threshold;
- and
- increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device,
- wherein the increasing of the power comprises increasing the power in response to determining that the first temperature exceeds the first threshold.
2 more elements
A system, comprising:
- a processing circuit;
- a memory;
- and
- a first thermoelectric cooler,
- the memory storing instructions that, when executed by the processing circuit, cause the processing circuit to:
- cause a temperature sensor to sense a first temperature of a first solid state drive;
- determine that the first temperature exceeds a first threshold;
- and
- cause a first drive circuit to increase a power supplied to the first thermoelectric cooler, the first thermoelectric cooler being thermally connected to the first solid state drive.
6 more elements
A system, comprising:
- means for processing;
- a memory;
- and
- a first thermoelectric cooler,
- memory storing instructions that, when executed by the means for processing, cause the means for processing to:
- sense a first temperature of a first solid state drive;
- determine that the first temperature exceeds a first threshold;
- and
- increase a power supplied to the first thermoelectric cooler, the first thermoelectric cooler being thermally connected to the first solid state drive.
6 more elements
Dependencies are inferred from the claim text.