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US 2021/0278885 A1Published application
Configurable heatsink
AssigneeNVIDIA Corporation
InventorsMichael L. Sabotta, Susheela N. Narasimhan, Reza Azizian, Herman W. Chu
Life of this patent
Estimating the term…
Abstract
Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.
Claims31
A system, comprising:
- one or more processors;
- and
- a heatsink connected by a flexible heat conduit to the one or more processors, wherein a position of the heatsink is adjustable.
A system, comprising:
- a heatsink;
- and
- a flexible heat conduit to connect to one or more processors, wherein a position of the heatsink, while connected to the one or more processors, is adjustable.
A method, comprising:
- providing a heatsink connectable, by a flexible heat conduit, to one or more processors, wherein a position of the heatsink, while connected to the one or more processors, is adjustable.
A graphics card, comprising:
- one or more graphics processing units;
- and
- a heatsink connected by a flexible heat conduit to the one or more graphics processing units, wherein a position of the heatsink is adjustable.
Dependencies are inferred from the claim text.