Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate

A plating apparatus comprising:

• a substrate holder configured to hold a substrate;
• and
• a plating tank configured to receive the substrate holder so as to perform plating treatment on the substrate, wherein
• the substrate holder includes a first holding member and a second holding member which sandwich and fix the substrate,
• the first holding member includes a first holding member body, and a clamp provided on the first holding member body, the clamp being rotatable about a shaft extending parallel to a surface of the first holding member body, or being reciprocable in a direction intersecting with the surface of the first holding member body,
• the second holding member includes a second holding member body, and
• the clamp is capable of engaging with the second holding member in a state where the first holding member body and the second holding member body are brought into contact with each other, to fix the second holding member to the first holding member.

A substrate holder comprising a first holding member and a second holding member configured to sandwich a substrate, wherein

• the first holding member includes:
• a first holding member body;
• at least one cable having one end portion from which a cover is removed;
• at least one first conductive member configured to be electrically contactable with the substrate;
• and
• a sandwiching member provided on the first holding member body, and configured to sandwich said one end portion of the cable together with the first conductive member or a second conductive member which is electrically coupled to the first conductive member.

A plating apparatus comprising:

• a substrate holder configured to hold a substrate;
• and
• a plating tank configured to receive the substrate holder so as to perform plating treatment on the substrate, wherein
• the substrate holder includes a first holding member, and the first holding member includes:
• a first holding member body;
• at least one cable having one end portion from which a cover is removed;
• at least one first conductive member configured to be electrically contactable with the substrate;
• and
• a sandwiching member provided on the first holding member body, and configured to sandwich said one end portion of the cable together with the first conductive member or a second conductive member which is electrically coupled to the first conductive member.