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US 2021/0277293 A1Published application
Carrier film for semi-conductor wafer processing
AssigneeTredegar Surface Protection, LLC
InventorsSurya SSUBRAMANIAM, Carl Douglas RAY, Kevin A. BRADY
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Abstract
A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G′) of less than or equal to 400 kPa at 25° C., and a first polyolefin elastomer. The core layer includes a second polyolefin elastomer, and the release layer includes a polyolefin.
Claims15
A carrier film, comprising:
- an adhesive layer comprising a hydrogenated styrene block copolymer having a storage modulus (G′) of less than or equal to 400 kPa at 25° C., and a first polyolefin elastomer;
- a core layer comprising a second polyolefin elastomer;
- and
- a release layer comprising a polyolefin.
1 more element
Dependencies are inferred from the claim text.