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US 2021/0277221 A1Published application
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMasashi OKANIWA, Takenori TAKIGUCHI, Kohei HIGASHIGUCHI, Tsuyoshi KIDA
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Abstract
A resin composition that has excellent flux activity, flexibility and storage stability and that is suitable for a pre-applied underfill material is provided. The resin composition contains a compound (A) having a phenolic hydroxy group, a metal ion trapping agent (B) and a radical polymerizable compound (C).
Claims28
A resin composition comprising:
- a compound (A) having a phenolic hydroxy group;
- a metal ion trapping agent (B);
- and
- a radical polymerizable compound (C).
1 more element
Dependencies are inferred from the claim text.