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US 2021/0276868 A1Published application
Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
AssigneeTDK Corporation
InventorsToshio ASAHI, Masamitsu HAEMORI, Masahito FURUKAWA, Hitoshi SAITA
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Abstract
To provide a dielectric composition having excellent reliability. The dielectric composition contains a main component represented by a composition formula (Sr1-xCax)m(Ti1-yHfy)O3-δNδ, in which 0.15<x≤0.90, 0<y≤0.15, 0.90≤m≤1.15, 0<δ≤0.05 are satisfied.
Claims6
A dielectric composition comprising:
- a main component represented by a composition formula
- (Sr1-xCax)m(Ti1-yHfy)O3-δNδ,
- wherein
- 0.15<x≤0.90,
- 0<y≤0.15,
- 0.90≤m≤1.15, and
- 0<δ≤0.05 are satisfied.
4 more elements
Dependencies are inferred from the claim text.