Semiconductor device package and a method of manufacturing the same

A semiconductor device package, comprising:

• a substrate comprising a core layer, an insulation layer, and a conductive layer;
• a MEMS device disposed on the substrate;
• and
• wherein a top surface of the core layer is lower than a top surface of the conductive layer, and the MEMS device covers the top surface of the core layer.

A semiconductor device package, comprising:

• a substrate comprising a core layer and an insulation layer;
• a MEMS device disposed on the substrate;
• a semiconductor device disposed on the substrate,
• wherein a bottom surface of the insulation layer is high than a top surface of the core layer, and the MEMS device covers the top surface of the core layer.