A MEMS Package
AssigneeIGNITE, Inc.
InventorsFusao Ishii, Victor Stone, Toshitaka Torikai
Life of this patent
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Abstract
A package encapsulating electronic components of one or more Micro-Electro-Mechanical Systems (MEMS) devices has hermetic seal that enables the use of a frame with rough surface. That is, the frame surrounds the components and is affixed to a surface of the substrate with a frame adhering layer. A cover is affixed to the frame with a cover adhering layer. Each of the frame adhering layer and the cover adhering layer comprises a solder layer between metallic adhesion layers. The solder layer comprises reflowed solder balls. The package enables direct contact of a substrate with a heat sink.
Claims20
A Micro-Electro-Mechanical Systems (MEMS) package, comprising:
- a MEMS device including a substrate on which an electronic circuit is formed;
- a frame surrounding the electronic circuit and affixed to a surface of the substrate with a frame adhering layer;
- and
- a cover affixed to the frame with a cover adhering layer, the cover encapsulating the electronic circuit within the frame, wherein each of the frame adhering layer and the cover adhering layer comprises a solder layer between at least two metallic adhesion layers, the solder layer comprising reflowed solder balls.
Dependencies are inferred from the claim text.