Wafer separating apparatus and wafer separating method
AssigneeKioxia Corporation
InventorSho KAWADAHARA
Life of this patent
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Abstract
A wafer separating apparatus is provided which includes a wafer supporting member having an upper surface on which a bonded wafer formed of two wafers bonded with each other is placed; an arm portion arranged outside of the wafer supporting member, the arm portion being movable closer to and away from a bonded portion of the bonded portion of the bonded wafer supported by the supporting portion; and an inflating portion provided in an distal end portion of the arm portion, the inflating portion being inflatable in a direction intersecting the upper surface of the wafer supporting member.
Claims14
A wafer separating apparatus comprising:
- a wafer supporting member having an upper surface on which a bonded wafer formed of two wafers bonded with each other is placed;
- an arm portion arranged outside of the wafer supporting member, the arm portion being movable forward and backward relative to a bonded portion of the bonded portion of the bonded wafer supported by the supporting portion;
- and
- an inflating portion provided in a distal end portion of the arm portion, the inflating portion being inflatable in a direction intersecting the upper surface of the wafer supporting member.
A wafer separating method comprising:
- supporting a bonded wafer formed of two wafers bonded with each other by a wafer supporting member having an upper surface on which the bonded wafer is placed;
- inserting a distal end portion of a predetermined arm portion into a bonded portion of the bonded wafer supported by the wafer supporting member;
- and
- inflating an inflating portion provided in the distal end portion of the arm portion in a direction intersecting the upper surface of the wafer supporting member.
Dependencies are inferred from the claim text.