Monolithic platen

A method of performing chemical mechanical planarization (CMP), comprising:

• removing a platen assembly from a first platen housing wherein the platen assembly comprises an upper platen and lower platen;
• inserting a monolithic platen into the first platen housing, wherein the monolithic platen is formed of a single piece of material with a continuously non-concave top surface having no holes therein;
• and
• delivering a slurry to the monolithic platen during performance of CMP.

A chemical mechanical planarization (CMP) method, comprising:

• removing a platen assembly from a first platen housing wherein the platen assembly comprises an upper platen and lower platen;
• providing a monolithic platen within a first platen housing, wherein the monolithic platen is formed of a single piece of material with a continuously non-concave top surface having no holes therein, wherein the monolithic platen comprises:
• a first portion within a first opening of the first platen housing, and
• a second portion within a second opening of the first platen housing, wherein the first portion has a different diameter than the second portion, and wherein the first and second portions form the single piece of material such that no interface exists between the first and second portions;
• providing a polishing fluid delivery conduit above the monolithic platen, wherein the polishing fluid delivery conduit is configured to deliver slurry to the monolithic platen during performance of CMP;
• and
• providing a platen assembly within a second platen housing, wherein the platen assembly comprises:
• an upper platen within a third opening of the second platen housing, and
• a lower platen below the upper platen and within the a fourth opening of the second platen housing, wherein the upper platen and the lower platen have different diameters and are formed from two separate pieces.