Particle removing assembly and method of servicing assembly

An apparatus for cleaning a cup, comprising:

• a cup adjacent to a wafer chuck to guard contaminant material against spreading into a chamber;
• a particle removing assembly configured to remove contaminant material from the cup;
• wherein the particle removing assembly comprises:
• a dispensing nozzle configured to eject pressurized cleaning material towards an incident point at an incident angle between the pressurized cleaning material and a dummy wafer, so that the pressurized cleaning material is reflected off the dummy wafer to an unreachable area from a linear fluidic access introduced by a curvature of the cup by rotating force, and
• a drying nozzle;
• and
• a controller communicating with the particle removing assembly, wherein the controller is configured to:
• determine, by a monitoring device, whether a variation in an amount of contaminant material in the unreachable area of the cup is within an acceptable range, and
• control the particle removing assembly such that the variation in an amount of contaminant material in the unreachable area of the cup is within the acceptable range during a cup cleaning operation.

A method of cleaning a cup in a wet process apparatus, the method comprising:

• providing a wet process apparatus comprises:
• a cup adjacent to a wafer chuck within a chamber;
• and
• a particle removing assembly configured to remove contaminant material from the cup;
• wherein the particle removing assembly comprises:
• a nozzle configured to eject pressurized cleaning material onto a dummy wafer, wherein the pressurized cleaning material is reflected off the dummy wafer to an unreachable area introduced by a curvature of the cup by rotating force;
• and
• a drying nozzle;
• ejecting the pressurized cleaning material through the nozzle of the particle removing assembly;
• rinsing the unreachable area of the cup;
• and
• drying, by the drying nozzle, the unreachable area of the cup.