Bonding system and bonding method

A bonding system that bonds a second article to a first article to be bonded, wherein

• the second article to be bonded is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article to be bonded,
• the bonding system comprising:
• a device for supplying the second article to be bonded that supplies the second article to be bonded;
• a bond device that bonds the second article to be bonded to the first article to be bonded by bringing the second article to be bonded into contact with the first article to be bonded;
• and
• a device for transporting the second article to be bonded that transports the second article to be bonded, supplied from the device for supplying the second article to be bonded, to the bond device, and
• the device for transporting the second article to be bonded comprises a holder for the second article to be bonded that holds a portion opposite to the bonding surface in the uneven portion of the second article to be bonded.

A bonding system that bonds a second article to a first article, the bonding system comprising:

• a substrate supporter that holds the first article to be bonded in a posture in which a bonding surface of the first article to be bonded faces vertically downward;
• a frame supporter that is placed vertically below the substrate supporter, and that supports a holding frame that holds a sheet to which the second article to be bonded is stuck in a posture in which a bonding surface of the second article to be bonded faces vertically upward;
• a head that abuts on a side opposite to a plurality of second articles to be bonded in the sheet;
• and
• a head driver that drives the head in a direction of approaching the substrate supporter, to thereby bond each of the second article to be bonded to the first article to be bonded.

A bonding method of bonding a second article a first article, wherein

• each second article to be bonded is a chip comprising an uneven portion on a circumference closer to a bonding surface of the second article to be bonded,
• the bonding method further comprising:
• a step of transporting the second article to be bonded, in which the second article to be bonded is transported;
• and
• a bonding step of bonding the second article to be bonded to the first article to be bonded by bringing the second article to be bonded into contact with the first article to be bonded, and
• in the step of transporting the second article to be bonded, a portion opposite to the bonding surface on the uneven portion of the second article to be bonded is held by a holder for the second article to be bonded, and the second article to be bonded is transported.