Integrated Circuit Package and Method

A device comprising:

• a package component comprising:
• a redistribution structure having a first diameter;
• a support ring attached to an edge of the redistribution structure, the support ring having an inner diameter and an outer diameter, the inner diameter being less than the first diameter, the outer diameter being greater than the inner diameter;
• and
• sockets disposed inside the support ring, the sockets attached to the redistribution structure;
• and
• a mechanical brace on the package component, the mechanical brace disposed inside the support ring.

A device comprising:

• a mechanical brace;
• a thermal module;
• and
• a package component between the thermal module and the mechanical brace, the package component comprising:
• an encapsulant;
• integrated circuit dies in the encapsulant;
• a redistribution structure comprising redistribution lines connected to the integrated circuit dies;
• sockets connected to the redistribution lines of the redistribution structure;
• and
• a metal ring attached to the redistribution structure, the metal ring laterally surrounding the sockets and the mechanical brace in a top-down view, the metal ring having a greater Young's modulus than the redistribution structure, the integrated circuit dies, and the encapsulant.