Semiconductor device and fabricating method thereof
AssigneeChangxin Memory Technologies, Inc.
InventorsPing-Heng WU, Dingyou LIN
Life of this patent
Estimating the term…
Loading patent…
AssigneeChangxin Memory Technologies, Inc.
InventorsPing-Heng WU, Dingyou LIN
Estimating the term…
A semiconductor device and a method of fabricating the same are disclosed. The semiconductor device includes: a semiconductor substrate including island patterns and trenches alternately arranged in a semiconductor substrate, wherein an upper surface of the island pattern close to a corresponding one of the trenches is a corner area; a patterned liner oxide layer covering an area of the upper surface of the island pattern except the corner area; and a protective layer covering the sidewalls and the bottom surface of the trench, the corner area and the side surface of the patterned liner oxide layer, wherein the protective layer extends from the sidewall of the trench to the corner area to form a corner; and an isolation structure located within each of the trenches. An area of the island pattern near the corner may be prevented from being oxidized.
A method of fabricating a semiconductor device, comprising:
A method of fabricating a semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.