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AssigneeEbara Corporation
InventorsAtsuo Katagiri, Itsuki Kobata
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A substrate processing apparatus includes a stage for holding a wafer, a catalyst processing member for processing the surface of the wafer using a catalyst, a pressing mechanism for pressing the catalyst processing member against the wafer, a relative motion mechanism for causing the catalyst processing member and the wafer to make a relative movement, and a supply mechanism for supplying a process liquid to the surface the wafer. The catalyst processing member has a processing surface opposed to the wafer, and includes a base material on which a groove is formed on the processing surface and the catalyst. The processing surface of the base material includes a plurality of regions sectioned by the groove. The catalyst processing member holds different types of catalysts in the plurality of regions.
A substrate processing apparatus comprising:
A method for fabricating a catalyst processing member for processing a surface to be processed of a substrate using a catalyst, the method comprising:
A method for fabricating a catalyst processing member for processing a surface to be processed of a substrate using a catalyst, the method comprising:
Dependencies are inferred from the claim text.