Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate

A method of forming a wiring harness assembly, comprising:

• selectively dispensing a dielectric material though an orifice in a dispensing head of an extruding device;
• selectively feeding a conductive wire through the orifice by operating a wire feed device;
• forming a plurality of electrically conductive wires by operating the wire feed device and selectively severing the conductive wire by operating a cutting device;
• forming a substrate of the dielectric material encasing the plurality of electrically conductive wires by operating the extruding device;
• forming an opening in the substrate having a predetermined size and shape in which a portion of plurality of electrically conductive wires is exposed by operating the extruding device;
• and
• forming a location feature in the substrate by operating the extruding device, wherein the location feature is located with a positional tolerance less than or equal to 1 mm relative to the opening.

A non-transitory computer readable storage medium having data stored therein representing software executable by a computer, the software including instructions to:

• command an extruding device to selectively dispense a dielectric material though an orifice;
• command a wire feed device to selectively feed a conductive wire through the orifice;
• command a cutting device to selectively sever the conductive wire, thereby forming a dielectric substrate encasing a plurality of electrically conductive wires;
• and
• commanding the extruding device to form an opening in the substrate in which the plurality of electrically conductive wires is exposed and a location feature defined in the substrate that is located with a positional tolerance less than or equal to 1 mm relative to the opening.