Heat-resistant thermally conductive composition and heat-resistant thermally conductive sheet

Abstract

A heat-resistant thermally conductive composition contains a matrix resin and thermally conductive particles, and contains a benzimidazolone compound as a heat resistance improver. Preferably, the benzimidazolone compound is a benzimidazolone pigment and is added in an amount of 0.001 to 5 parts by mass with respect to 100 parts by mass of the heat-resistant thermally conductive composition. Preferably, the matrix resin component is a silicone polymer. Preferably, the heat-resistant thermally conductive composition has an Asker C hardness of 70 or less after curing. With these, provided are a heat-resistant thermally conductive composition and a heat-resistant thermally conductive sheet that use the heat resistance improver containing no metal atom and that are less likely to become hard at high temperature.

Dependencies are inferred from the claim text.