Thermosetting polyimide resin and manufacturing method thereof, composition, prepolymer, film, adhesive, and use thereof
AssigneeChin Yee Chemical Industries Co.,Ltd.
InventorPi-Tao Kuo
Life of this patent
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AssigneeChin Yee Chemical Industries Co.,Ltd.
InventorPi-Tao Kuo
Estimating the term…
The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the thermosetting polyimide resin. The disclosure provides the thermosetting polyimide resin and the prepolymer, for manufacturing a film, an adhesive sheet, a cover film, a redistribution layer, a build-up board, a prepreg sheet, a high-frequency substrate, an integrated circuits carrier board, an adhesive for copper foil, a semiconductor packaging material, a radome, a substrate for server, a substrate for base station, a substrate for vehicle, etc.
A thermosetting polyimide resin, with a chemical structure thereof shown in Formula (1):
A manufacturing method of a thermosetting polyimide resin, wherein a chemical structure of the thermosetting polyimide resin is shown in Formula (1):
A thermosetting polyimide resin composition, comprising at least:
A thermosetting polyimide prepolymer, obtained by performing a prepolymerization reaction on (a) a fluorine-containing maleimide compound and (b) a thermosetting polyimide resin, wherein
Dependencies are inferred from the claim text.