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US 2021/0261731 A1Published application
Hard-mask forming composition, method for manufacturing electronic component, and resin
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorKeiichi IBATA
Life of this patent
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Abstract
A hard-mask forming composition including a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0), wherein Ar01 and Ar02 are aromatic hydrocarbon groups which may have a substituent, Ar02 has at least one nitrogen atom or oxygen atom, L01 and L02 are each independently a single-bonded or divalent linking group, and X is NH4 and the like
Claims8
A hard-mask forming composition comprising:
- a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0):
- wherein Ar01 is an aromatic hydrocarbon group which may have a substituent, L01 and L02 are each independently a single-bonded or divalent linking group, Ar02 is an aromatic hydrocarbon group which may have a substituent, provided that Ar02 has at least one nitrogen atom or oxygen atom, and X is a hydrogen atom, NH4, a compound obtained by adding a hydrogen atom to an amine, or a quaternary ammonium.
A resin having a repeating structure (u1) represented by General Formula (u1-0):
- wherein Ar01 is an aromatic hydrocarbon group which may have a substituent, L01 and L02 are each independently a single-bonded or divalent linking group, Ar02 is an aromatic hydrocarbon group which may have a substituent, provided that Ar02 has at least one nitrogen atom or oxygen atom, and X is a hydrogen atom, NH4, a compound obtained by adding a hydrogen atom to an amine, or a quaternary ammonium.
Dependencies are inferred from the claim text.