Method for transferring at least one layer of material from a first substrate to a second substrate

A method for transferring at least one layer of material from a first substrate to a second substrate, including at least:

• producing first and second separating layers disposed one against the other on a face of the first substrate and such that the first separating layer is disposed between the first substrate and the second separating layer;
• producing said at least one layer of material to be transferred on the second separating layer;
• securing said at least one layer of material to be transferred to the second substrate, forming a stack of different materials;
• performing mechanical separation at an interface between the first and second separating layers, such that the first separating layer remains integral with the first substrate and that the second separating layer remains integral with said at least one layer of material to be transferred;
• wherein the materials of the stack are chosen such that the interface between the first and second separating layers corresponds to the interface, of all of the interfaces of the stack, having the weakest adhesion force, and wherein the method includes, between the step of producing first and second separating layers and the step of securing, the implementation of at least one step reducing an initial adhesion force of the interface between the first and second separating layers.