Multi-function adapting modules for electronics cooling
AssigneeBaidu USA LLC
InventorTianyi Gao
Life of this patent
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AssigneeBaidu USA LLC
InventorTianyi Gao
Estimating the term…
A modular cooling system includes a fluid pump in fluid communication with one or more cooling elements to cool electronics components; a heat exchanger in fluid communication with the fluid pump; a heat exchanger valve upstream of the heat exchanger; and a fluid supply valve positioned between a cooling fluid supply and the one or more cooling elements. When the heat exchanger valve and the fluid supply valve are in a first position, fluid is directed from the cooling fluid supply to the one or more cooling elements, bypassing the heat exchanger and the fluid pump. When the heat exchanger valve and the fluid supply valve are in a second position, fluid is cut off from the cooling fluid supply and a cooling fluid return and circulated through the heat exchanger and the fluid pump.
A modular cooling system, comprising:
An adapting cooling module comprising:
A method of cooling a server comprising:
Dependencies are inferred from the claim text.