Direct inkjet printing of infrastructure for integrated circuits

An inkjet printing method for forming infrastructure element for an integrated circuit in a printed circuit board, the method comprising:

• a) providing a substrate;
• b) providing an ink jet printing system comprising:
• i. a first print head having:
• at least one aperture, a dielectric ink reservoir, and a first dispenser configured to supply the dielectric ink through the aperture;
• ii. a second print head having:
• at least one aperture, a conductive ink reservoir, and a second dispenser configured to supply the conductive ink through the aperture;
• iii. a conveyor, operably coupled to the first print head and to the second print head, configured to convey the substrate to the first and second print head;
• and
• iv. a computer aided manufacturing (“CAM”) module, comprising:
• a processor;
• a non-volatile memory;
• and a set of executable instructions stored on the non-volatile memory configured, when executed to cause the processor to:
• receive a 3D visualization file representing the infrastructure element being at least one of:
• a cooling pad, a heat-pipe, a condenser, a wick, a cooling platform, and a vapor chamber;
• using the 3D visualization file, generate a library comprising a plurality of files, each file representing a substantially 2D layer for printing of the infrastructure element;
• receive a selection of parameters related to the infrastructure element;
• and alter each of the substantially 2D layer file in the library based on at least one of the selection of parameters for printing at least one of a conducting portion and a dielectric portion of the infrastructure element;
• c) providing a dielectric ink composition and a conductive ink composition;
• d) using the CAM module, obtaining the generated file representing the plurality of substantially 2D layer of the infrastructure element for printing, the 2D layer comprising a pattern representative of the conductive inkjet ink and the dielectric inkjet ink, wherein the file obtained correspond to a first layer for printing;
• e) using the first print head, forming the pattern corresponding to the dielectric representation in the first layer of the infrastructure element for printing;
• f) curing the dielectric pattern;
• g) using the second print head, forming the pattern corresponding to the conductive representation in the first layer of the infrastructure element for printing;
• h) sintering the conductive pattern;
• and
• i) repeating the steps from obtaining the generated file, wherein the file obtained correspond to a subsequent layer to a precedent layer for printing, to the step of sintering the conductive layer to the completion of the library;
• and wherein the printed circuit board is a multi-layered printed circuit board defining a hollow intermediate layer and wherein at least one of:
• the cooling pad, the heat pipe, and the wick terminates at the hollow intermediate layer.