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US 2021/0243901 A1Published application
Printed circuit board and method of fabricating the same
AssigneeLG Innotek Co., Ltd.
InventorsYun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
Life of this patent
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Abstract
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Claims19
A circuit board comprising:
- an insulating layer;
- a plating seed layer disposed on the insulating layer;
- a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu);
- and
- a protective layer disposed on the insulating layer to cover a surface of the insulating layer,
- wherein the circuit pattern layer includes a top surface, a bottom surface having a width greater than a width of the top surface, and a side surface connecting the top surface and the bottom surface, and
- wherein the side surface of the circuit pattern layer has a curved surface connected to the top surface.
4 more elements
A circuit board comprising:
- an insulating layer;
- a plating seed layer disposed on the insulating layer;
- a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu);
- a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au);
- and
- a protective layer disposed on the insulating layer to cover a surface of the insulating layer,
- wherein a width of a top surface of the circuit pattern layer is narrower than a width of a bottom surface of the circuit pattern layer,
- wherein the circuit pattern layer includes a top surface, a bottom surface having a width greater than a width of the top surface, and a side surface connecting the top surface and the bottom surface,
- wherein the side surface of the circuit pattern layer has a curved surface spaced apart from the bottom surface of circuit pattern layer.
6 more elements
Dependencies are inferred from the claim text.