A pcb structure for embedding electronic components
AssigneeUniversity of Limerick
InventorsJohn Harris, Jennifer Hennessy, Seamus Clifford, Mark Southern
Life of this patent
Estimating the term…
Abstract
A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.
Claims21
A printed circuit board (PCB) structure for forming at least one embedded printed electronic component comprising:
- a multi-layer PCB board comprising at least one through-hole via comprising an inner wall, the via comprising:
- a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring;
- and
- an isolation section separating each of the electrodes,
- wherein the inner wall of the via is provided with a coating of one or more electronically active materials, such that each electronically active material makes electrical contact with at least two electrodes of the plurality of electrodes to form the at least one embedded printed electronic component.
A method of fabricating a printed circuit board (PCB) structure for embedding at least one printed electronic component, the method comprising:
- forming a multi-layer PCB, printed circuit board, comprising:
- an upper PCB section, a lower PCB section, and an intermediate PCB section between the upper PCB section and the lower PCB section;
- boring a through-hole of a first diameter in the multi-layer PCB;
- counter-boring a hole of a second diameter from the hole in the lower PCB section to a height marginally greater than the lower PCB section and/or counter-boring a hole of the second diameter from the hole in the upper PCB section to a depth marginally greater than the upper PCB section, wherein the second diameter is greater than the first diameter;
- plating the inner wall of the bored hole to form a via;
- and
- selectively removing at least one band of plating from the via so as to create a plurality of vertically aligned electrodes within the via, each electrode comprising a plated ring, and each electrode separated by an isolation section;
- wherein the step of selectively removing at least one band of plating from the via comprises:
- back-drilling a hole of a third diameter from at least one counter-bored via to at least one predetermined depth of the PCB, wherein the third diameter is greater than the first diameter and less that the second diameter,
- and wherein the method further comprises the step of coating the inner wall of the via with one or more electronically active materials such that each electronically active material makes electrical contact with at least two electrodes of the plurality of electrodes to form the at least one embedded printed electronic component.
(canceled)
Dependencies are inferred from the claim text.