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US 2021/0243892 A1Published application
Wiring substrate and electronic device
AssigneeKYOCERA Corporation
InventorsSeiichirou ITOU, Yuichiro ISHIZAKI, Genshitaro KAWAMURA
Life of this patent
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Abstract
A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.
Claims20
A wiring substrate, comprising:
- an insulating substrate comprising a principal face;
- a wiring line located on the principal face;
- and
- a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protruding from the side along the principal face.
1 more element
Dependencies are inferred from the claim text.