Back to results
US 2021/0243889 A1Published application
Component Carrier With Embedded Component Exposed by Blind Hole
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMikael Tuominen, Seok Kim Tay
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a component carrier is disclosed. The method includes providing a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, embedding a component in the stack, drilling a blind hole in the stack towards the embedded component, and thereafter extending the blind hole by etching to thereby expose a surface portion of the embedded component.
Claims19
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- embedding a component in the stack;
- creating, in particular drilling, a blind hole in the stack towards the embedded component;
- and
- thereafter extending the blind hole by etching to thereby expose a surface portion of the embedded component.
2 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a component embedded in the stack;
- and
- a blind hole in the stack exposing a surface portion of the embedded component and having at least partially curved sidewalls delimited by the stack.
1 more element
Dependencies are inferred from the claim text.